BGA Heat Sinks

Compatible with ball grid array (BGA) devices, Same Sky’s BGA heat sinks are made from aluminum or copper with a black anodized or clean finish and feature adhesive or PCB mounting. Our BGA heat sinks support a wide range of sizes from 8.5 x 8.5 mm up to 69.7 x 69.7 mm with profiles from 5 to 25 mm. Measured under four conditions for thermal resistance, our BGA heat sinks carry power dissipation ratings from 1.92 up to 21.74 W at 75°C.

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Results 45
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Mounting Style
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Adhesive
PCB
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Rth @ 75°C ΔT, nat conv (°C/W)
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Min
Max
GO
3.45
4.74
6.41
6.43
6.65
7.56
7.62
7.77
7.96
8.35
8.74
8.97
9.16
10.05
10.09
11.11
11.63
11.84
12.23
12.36
12.63
12.67
12.72
13.7
15.05
15.19
15.41
17.22
17.39
17.53
17.87
18.1
19.59
20.41
23.68
23.91
24.01
24.08
25.33
25.4
25.46
29.73
35.98
37.9
39.1
Reset
Rth @ 1 W, nat conv (°C/W)
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Min
Max
GO
4.2
5.1
7.8
7.9
9
9.6
9.9
10.1
10.2
10.6
11.1
12.1
12.7
13.5
13.8
14.7
14.8
15
15.1
16.1
16.8
17.2
17.9
18.2
19.5
20.7
20.8
21.3
22.5
23
24
24.5
28.5
28.8
29.1
29.2
31.2
39.7
41.9
43.3
Reset
Rth @ 1 W, 200 LFM (°C/W)
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Min
Max
GO
1.2
1.4
2.1
2.6
2.7
2.8
2.9
3.2
3.6
3.8
3.9
4
4.3
4.4
4.5
4.7
5.1
5.3
6
6.3
6.5
6.8
7.8
8.4
8.6
8.8
9.6
9.7
9.9
13.1
15.8
16
16.5
Reset
Rth @ 1 W, 400 LFM (°C/W)
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Min
Max
GO
0.8
0.9
1.4
1.5
1.6
1.7
1.9
2.1
2.4
2.6
2.9
3
3.1
3.2
3.3
3.4
3.7
4
4.3
4.7
5.7
5.8
6
6.1
6.7
6.8
9.3
11.2
11.6
12.3
Reset
PD @ 75°C ΔT, nat conv (W)
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Min
Max
GO
1.92
1.98
2.08
2.52
2.95
2.96
3.11
3.12
3.14
3.17
3.67
3.83
4.14
4.2
4.28
4.31
4.36
4.87
4.94
4.98
5.47
5.9
5.92
5.94
6.07
6.13
6.33
6.45
6.75
7.43
7.46
8.18
8.36
8.59
8.98
9.43
9.65
9.84
9.92
11.28
11.66
11.69
15.83
21.74
Reset
Length (mm)
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Min
Max
GO
8.5
10
12
14
17
18
20
21
23
25
27
27.9
28.5
30
30.7
33.5
35
37.4
38.1
40
43.1
45
60
69.7
Reset
Width (mm)
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Min
Max
GO
8.5
10
12
14
17
18
20
21
23
25
27
27.9
28.5
30
30.7
33.5
35
37.4
38.1
40
43.1
45
60
69.7
Reset
Height (mm)
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Min
Max
GO
5
6
7
8
9
10
11.2
11.5
14
14.1
15
16.51
18
19
22
23
25
Reset

Rth = Thermal Resistance, PD = Power Dissipation


Results 45
of ?
Results 45
of ?

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