HSB39-252509P

HSB39-252509P
HSB39-252509P Alternate View

HSB39-252509P

25 x 25 mm, BGA Heat Sink, Aluminum, PCB, Push Pins

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 18.7
Thermal Resistance @ 1 W, nat conv (°C/W) 22.3
Thermal Resistance @ 1 W, 200 LFM (°C/W) 7.2
Thermal Resistance @ 1 W, 400 LFM (°C/W) 5
Material AL6063-T5
Power Dissipation @ 75°C ΔT, nat conv (W) 4.01
Material Finish Black Anodized
Thermal Pad No
Dimensions LxWxH (mm) 25 x 25 x 9
Dimensions LxWxH (in) 0.984 x 0.984 x 0.354

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